HBM tracker

HBM Tracker logs 42 HBM stacks from SK hynix, Samsung and Micron, from the first four-high HBM to sixteen-high HBM4E. Production stacks top out at 36GB and twelve layers, and Samsung’s HBM4 reaches 3.3 TB/s per stack. Samples already hit 48GB and 16 Gb/s per pin. Every figure links its source, with the accelerators each maker confirms.

42 configurations39 first-party sourcesVerified 2026-11-11

Every sourced stack

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Per stack. “Over” and “up to” preserve vendor bounds. A dash means no published figure in the cited evidence. Select rows to compare; scroll sideways for all columns.

Samsung HBM4E 64GBSamsung1HBM4E1161641——Planned12026-11-11
Micron HBM4 48GBMicron1HBM41161481——Sampling12026-11-11
Samsung HBM4 48GBSamsung1HBM41161481——Planned12026-11-11
Samsung HBM4E 48GBSamsung1HBM4E1121481141Up to 3,6001Sampling12026-11-11
SK hynix HBM3E 48GBSK hynix1HBM3E1161481——Demonstrated22026-11-11
SK hynix HBM4 48GBSK hynix1HBM41161481At least 111Over 2,8001Demonstrated42026-11-11
SK hynix HBM4E 48GBSK hynix1HBM4E1121481Up to 161—Sampling12026-11-11
Micron HBM3E 36GBMicron1HBM3E1121361Over 9.21Over 1,2001Production reported32026-11-11
Micron HBM4 36GBMicron1HBM41121361Over 111Over 2,8001Production reported12026-11-11
Samsung HBM3E 36GBSamsung1HBM3E1121361Up to 9.21Up to 1,1801Catalogued12026-11-11
Samsung HBM4 36GBSamsung1HBM4112136111.71Up to 3,3001Production reported12026-11-11
SK hynix HBM3E 36GBSK hynix1HBM3E1121361At least 9.61At least 1,2301Production reported22026-11-11
SK hynix HBM4 36GBSK hynix1HBM41121361At least 111Over 2,8001Family production reported62026-11-11
Samsung HBM4E 32GBSamsung1HBM4E181321——Planned12026-11-11
Micron HBM3E 24GBMicron1HBM3E181241Over 9.21Over 1,2001Production reported32026-11-11
Samsung 12-layer TSV · 24GBSamsung1HBM21121241——Demonstrated12026-11-11
Samsung HBM3 24GBSamsung1HBM31121241Up to 6.41Up to 8191Production reported22026-11-11
Samsung HBM3E 24GBSamsung1HBM3E181241Up to 9.21Up to 1,1801Catalogued12026-11-11
Samsung HBM4 24GBSamsung1HBM4112124111.71Up to 3,3001Production reported12026-11-11
SK hynix HBM3 24GBSK hynix1HBM31122242Up to 6.42Up to 8192Sampling12026-11-11
SK hynix HBM3E 24GBSK hynix1HBM3E181241At least 9.61At least 1,2301Production reported22026-11-11
SK hynix HBM4 24GBSK hynix1HBM4181241At least 111Over 2,8001Catalogued12026-11-11
Micron HBM2E 16GBMicron1HBM2E181161Up to 3.21Up to 4101Catalogued12026-11-11
Samsung Flashbolt 16GBSamsung1HBM2E1811613.214101Planned12026-11-11
Samsung HBM3 16GBSamsung1HBM3181161Up to 6.41Up to 8191Production reported22026-11-11
SK hynix HBM2E 16GBSK hynix1HBM2E181161Range 3.2–3.61Range 410–4601Production reported22026-11-11
SK hynix HBM3 16GBSK hynix1HBM3182162Up to 6.42Up to 8192Production reported32026-11-11
Micron HBM2E 8GBMicron1HBM2E14181Up to 3.21Up to 4101Catalogued12026-11-11
Samsung Aquabolt 8GBSamsung1HBM2181812.41307.21Production reported12026-11-11
Samsung HBM2 8GB · first generationSamsung1HBM218181—2561Production reported12026-11-11
SK hynix HBM2 8GB · 1 Gb/sSK hynix1HBM218181111281Historical catalog12026-11-11
SK hynix HBM2 8GB · 1.6 Gb/sSK hynix1HBM2181811.612041Historical catalog12026-11-11
SK hynix HBM2 8GB · 2 Gb/sSK hynix1HBM218181212561Historical catalog12026-11-11
SK hynix HBM2E 8GBSK hynix1HBM2E14181Range 3.2–3.61Range 410–4601Catalogued12026-11-11
Samsung HBM2 4GB · first generationSamsung1HBM214141—2561Production reported12026-11-11
SK hynix HBM2 4GB · 1 Gb/sSK hynix1HBM214141111281Historical catalog12026-11-11
SK hynix HBM2 4GB · 1.6 Gb/sSK hynix1HBM2141411.612041Historical catalog12026-11-11
SK hynix HBM2 4GB · 2 Gb/sSK hynix1HBM214141212561Historical catalog12026-11-11
SK hynix HBM2 2GB · 1 Gb/sSK hynix1HBM212121111281Historical catalog12026-11-11
SK hynix HBM2 2GB · 1.6 Gb/sSK hynix1HBM2121211.612041Historical catalog12026-11-11
SK hynix HBM2 2GB · 2 Gb/sSK hynix1HBM212121212561Historical catalog12026-11-11
SK hynix HBM · 4-highSK hynix1HBM141—13—Historical catalog12026-11-11

Stack height, 2014 to today

Full dated timeline
Published stack-height milestonesDRAM layers against the date of each record’s status evidence. Circles are production reports, squares are historical catalogs or demonstrations, triangles are samples or plans. Each point links to a record; the full list follows. 2H4H8H12H16H 20132015201720192021202320252027 Micron HBM3E 24GB — 2024-02-26 — Production reportedMicron HBM3E 36GB — 2025-06-25 — Production reportedMicron HBM4 36GB — 2026-03-16 — Production reportedMicron HBM4 48GB — 2026-03-16 — SamplingSamsung 12-layer TSV · 24GB — 2019-10-07 — DemonstratedSamsung Aquabolt 8GB — 2018-01-11 — Production reportedSamsung Flashbolt 16GB — 2020-02-04 — PlannedSamsung HBM2 4GB · first generation — 2016-01-19 — Production reportedSamsung HBM2 8GB · first generation — 2017-07-18 — Production reportedSamsung HBM3 16GB — 2023-10-21 — Production reportedSamsung HBM3 24GB — 2023-10-21 — Production reportedSamsung HBM4 24GB, Samsung HBM4 36GB — 2026-02-12 — Production reportedSamsung HBM4 48GB — 2026-02-12 — PlannedSamsung HBM4E 32GB — 2026-05-29 — PlannedSamsung HBM4E 48GB — 2026-05-29 — SamplingSamsung HBM4E 64GB — 2026-05-29 — PlannedSK hynix HBM · 4-high — 2014 — Historical catalogSK hynix HBM2 2GB · 1 Gb/s, SK hynix HBM2 2GB · 1.6 Gb/s, SK hynix HBM2 2GB · 2 Gb/s — 2016-08 — Historical catalogSK hynix HBM2 4GB · 1 Gb/s, SK hynix HBM2 4GB · 1.6 Gb/s, SK hynix HBM2 4GB · 2 Gb/s — 2016-08 — Historical catalogSK hynix HBM2 8GB · 1 Gb/s, SK hynix HBM2 8GB · 1.6 Gb/s, SK hynix HBM2 8GB · 2 Gb/s — 2016-08 — Historical catalogSK hynix HBM2E 16GB — 2020-07-02 — Production reportedSK hynix HBM3 16GB — 2022-06-08 — Production reportedSK hynix HBM3 24GB — 2023-04-20 — SamplingSK hynix HBM3E 24GB — 2024-03-19 — Production reportedSK hynix HBM3E 36GB — 2024-09-26 — Production reportedSK hynix HBM3E 48GB — 2025-01-10 — DemonstratedSK hynix HBM4 36GB — 2025-10-29 — Family production reportedSK hynix HBM4 48GB — 2026-01-05 — DemonstratedSK hynix HBM4E 48GB — 2026-06-18 — Sampling DRAM layers (base die excluded)

Each mark is a dated maker milestone. Circle: production. Square: catalog or demonstration. Triangle: sample or plan. Fill shows the maker.

Confirmed platform connections

How to read design-ins

Every link below is named by the memory maker or the platform vendor, and each part page carries the evidence. For the packaging, bonding and test companies behind these stacks, see HBM Suppliers.

Reading the HBM market

Which HBM stacks are in production today?

HBM4 is shipping from all three makers: Samsung since February 2026, Micron since its March 2026 volume-production release, and SK hynix with mass shipments from Q2 2026. The densest production stack is 36GB with twelve DRAM layers. HBM3E 24GB and 36GB stacks ship in NVIDIA Hopper and Blackwell and AMD MI350 platforms.

What is the fastest HBM stack?

Samsung’s HBM4E sample leads bandwidth at up to 3.6 TB/s per stack, at a stable 14 Gb/s per pin. SK hynix’s HBM4E sample is rated up to 16 Gb/s per pin. In production, Samsung HBM4 runs 11.7 Gb/s and up to 3.3 TB/s; SK hynix and Micron HBM4 run over 11 Gb/s and over 2.8 TB/s.

Does more stack height mean more bandwidth?

No. Stack height sets capacity: twelve 24Gb dies make a 36GB stack, sixteen make 48GB. Bandwidth comes from interface width and pin rate. HBM4 doubles the interface to 2,048 bits, which is why it more than doubles HBM3E bandwidth at a similar layer count.

Which accelerators use which maker’s HBM?

The tracker lists a platform only when the memory maker or the platform vendor names it. SK hynix supplies 36GB HBM4 for NVIDIA Vera Rubin, Micron ships HBM3E in NVIDIA H200 and designs into GB300 and AMD MI355X, and Samsung is AMD’s primary HBM3E partner for MI350X and MI355X.

What does stack capacity mean?

Capacity is per HBM stack. An accelerator multiplies it by its stack count: eight 36GB HBM3E stacks give AMD MI355X its 288GB. For the companies that package, bond and test these stacks, see hbmsuppliers.com.

Take the data with you

Download the CSV or JSON under CC BY 4.0. Credit HBM Tracker and retain the original source links. The methodology explains identity, status dates and rating changes.